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X-WR-CALDESC:Veranstaltungen für EFDS
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DTSTART;VALUE=DATE:20260601
DTEND;VALUE=DATE:20260602
DTSTAMP:20260502T084518
CREATED:20251209T120636Z
LAST-MODIFIED:20260428T045505Z
UID:10000246-1780272000-1780358399@efds.org
SUMMARY:3rd European Surface Networking Summit
DESCRIPTION:Innovation at the intersection of business and research is an important step to strengthen Europe and the European Community for surface engineering technology. We offer the opportunity to find international cooperation partners for your topics in order to keep the players in contact and accelerate the innovation process. International Funding Programs provides a variety of possibilities to get funding for international research projects. \nAim of the Meeting \n\nInformation on European Funding\nInternational Network Presentations\nResearch Needs & potential Cooperation Partners\n\n\nIndustrial wanted topics \n\ndevelopment for hydrogen technology and electrolysers\nbattery technology\npower-2-x\nmaterial alternatives\n\nProgram 3. European Surfcae Networking Summit [PDF] \nYou would like to present your network or your project Teaser to find cooperation partners?\nGet in contact with us! \nContact \nDr. Katrin Ferse\nEuropean Society of Thin Films\nE-Mail: ferse@efds.org\nPhone: +49 351 87183274
URL:https://efds.org/event/3-esns/
LOCATION:online
ORGANIZER;CN="European Society of Thin Films":MAILTO:info@efds.org
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20270316
DTEND;VALUE=DATE:20270318
DTSTAMP:20260502T084518
CREATED:20260327T091052Z
LAST-MODIFIED:20260327T091148Z
UID:10000267-1805155200-1805327999@efds.org
SUMMARY:ALD for Industry 2027
DESCRIPTION:The 10th International Conference „ALD FOR INDUSTRY“ will bridge the gap between fundamental science\, industrialization and commercialization of this technology. Atomic layer deposition (ALD) is a process for depositing a variety of thin film materials from the vapor phase of matter. The conference topics range from developments and trends of the coating technology and the ALD equipment to applications in the semiconductor industry\, power devices\, advanced packaging\, sensors and energy technologies. \nAt the conference recent developments for ALD processes\, simulation and characterization of coatings and coating processes\, precursor materials\, ALD systems and coatings for special applications are presented. Beside the Conference\, you will have the chance to meet industrial experts and get informed about new materials\, coating systems\, measurement technology for quality management and suitable equipment in the exhibition. During the tutorials basic knowledge will be refreshed or extended with new insights and basic process understanding. \nThis event is already established since 2016 and attracts annually more than 100 participants and numerous exhibitors to visit Dresden. Get informed about recent progress in the field and to get in contact with industrial and academic partners. Increase your visibility and present your company in our accompanying exhibition. The next event will take place on March 16 – 17\, 2027 in Dresden\, Germany. Please\, do not miss the chance to submit your abstract to present your recent research in the field of ALD\, show application examples or present accompanying technologies like metrology\, combinations of technological approaches like plasma technology or vacuum technologies. \nTemplate for Abstract [PDF] \nAbstract Submission Deadline for Oral Presentations: September 15\, 2026\nAbstract Submission Deadline for Poster Presentations: January 31\, 2027
URL:https://efds.org/event/ald-for-industry-2027/
ORGANIZER;CN="European Society of Thin Films":MAILTO:info@efds.org
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