International Conference: ALD for industry

The 6th International Conference „ALD FOR INDUSTRY“ will again show the bridge between basic science, industrialisation and commercialisation of this technology.

Atomic layer deposition (ALD) is a process used to deposit a wide variety of thin film materials from the vapor phase of matter. The Global Atomic Layer Deposition ALD Equipment Market Size was estimated at USD 1296.62 million in 2021 and is projected to reach USD 6744.66 million by 2028, exhibiting a CAGR of 26.56% during the forecast period. The growth of this technology is not only based in microelectronics applications, but also in areas of industrial Li-Ion batteries, photovoltaics and quantum technology. Atomic layer deposition, is a thin film technology that enables new and highly innovative products for a wide range of applications.

In 2023 the EFDS will organize the 6th workshop „ALD FOR INDUSTRY“ in Dresden (Germany), at one of the focal points of European thin-film technologies in industrial applications and research. „ALD for industry provides the opportunity to get in touch with industrial and academic partners, to learn more about fundamentals and potential application of ALD technology

The Workshop will focus on the currents markets for ALD and address the applications in Semiconductor industry, MEMS &Sensors, Battery technology, Medical, Display, Lightning and Photovoltaics.

DETAILED INFORMATION DOWNLOAD

General Information [PDF]

Booking Form Sponsor [PDF]

CONFIRMED TALKS

ALD within polymers- hybrid materials and nanostructure fabrication
Tamar Segal-Peretz, Technion-Israel Institute of Technology, Haifa, Israel

Low temperature PEALD: Analysis to high throughput industrial applications
Vivek Beladiya, Plasma Electronic GmbH, Neuenburg am Rhein, Germany

The right ligand with the right metal for selective deposition, etch or inhibition
Simon Elliott, Schrödinger, New York, USA

From planar to 3D-objects ALD – Innovative Solutions for Sustainable Applications
Sebastian Lehmann, Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden, Dresden, Germany

Flash Lamp Enabled Atomic Layer Deposition
Yuanhe Cui, Technische Universität Dresden, Dresden, Germany

Group III-Nitride semiconductor materials made by low temperature plasma based Atomic Layer Deposition
Noureddine Adjeroud, Luxembourg Institute of Science and Technology, Esch-sur-Alzette, Luxembourg

In-situ gas monitoring of ALD processes using remote optical emission spectroscopy
Joseph Brindley, Gencoa, Liverpool, United Kingdom; Carlos Guerra, Swiss Cluster, Thun, Switzerland

Fighting ALD’s biggest demons: reducing CoO and process time, one batch at a time
Christoph Hossbach, Picosun, Dresden, Germany

Superconducting NbN layers deposited by PEALD
Jakob Zessin, SENTECH Instruments GmbH, Berlin, Germany

COCOS measurements on silicon oxides, deposited by SAM24 and O2 plasma / ozone
Henry Bernhardt, Arne Ohlsen, Infineon Technologies AG, Dresden, Germany

ALD Metal-Dielectric Heterostructures down to Atomic Scale
Adriana Szeghalmi, Fraunhofer IOF, Jena, Germany

Synthesis of photocatalytic nanocomposites by low-temperature ALD for water remediation
Giuliana Impellizzeri, Italian National Research Council (CNR) – Institute for Microelectronics and Microsystems (IMM), Catania, Italy

Remote plasma ALD and ALE for power electronics
Michael Powell, Oxford Instruments Plasma Technology, Bristol, United Kingdom

Atomic layer deposition for halide perovskite solar cells
Marianna Kemell, University of Helsinki, Helsinki, Finland

ALE (Atomic Layer Etch) and PEALD (Plasma Enhanced Atomic Layer Deposition) in one Chamber (FALP) with high throughput
Stephan Wege, plasway-Technologies GmbH, Bannewitz-Cunnersdorf, Germany

Atomic Layer Deposition of Cobalt films on a scia Atol 200
Mathias Franz, Fraunhofer ENAS, Marcus Daniel, scia Systems GmbH, Chemnitz, Germany

From Fundamentals to Industrial Application: The various Shades of Precursor Chemistry
David Zanders, Ruhr University Bochum, Bochum, Germany

Sequential Infiltration Synthesis for Organized Nanostructure Fabrication
Gabriele Seguini, CNR IMM, Agrate Brianza, Italy

Further speakers and detailed information you will find here shortly. We plan 20 Workshop Talks and 6 Tutorial Talks.

PROGRAM COMMITTEE

Jamie Greer, Air Liquide Advanced Materials, Paris, France
Dr. Christoph Hossbach, Picosun Oy and Picosun Europe GmbH, Dresden, Germany
Dr. Martin Knaut, IHM, TU Dresden, Germany
Prof. Mikko Ritala, University of Helsinki, Helsinki, Finland
Dr. Jonas Sundqvist, BALD Engineering AB, Wärmdö, Sweden
Dr. Claudia Wiemer, CNR IMM, Unit of Agrate Brianza, Italy