The 8th International Conference “ALD FOR INDUSTRY” will again bridge the gap between fundamental science, industrialization and commercialization of this technology. Atomic layer deposition (ALD) is a process for depositing a variety of thin film materials from the vapor phase of matter. The growth of this technology is not only based in microelectronics applications, but also in areas of industrial Li-Ion batteries, photovoltaics, optics, light, biomedicine and quantum technology.
This event is already established since 2017 and attracts annually more than 100 participants and numerous exhibitors to visit Dresden. The Conference with Tutorial provides the opportunity to learn more about fundamentals of ALD technology, to get informed about recent progress in the field and to get in contact with industrial and academic partners. Increase your visibility and present your company in our accompanying exhibition.
The next event will take place in March 11 – 12, 2025 in Dresden. Please do not miss the chance to submit your abstract to present your recent research in the field of ALD, show application examples or present accompanying technologies like metrology, combinations of technological approaches like plasma technology or vacuum technologies.
General Information to the event & Hotel Recommendations
Template Abstract ALD for Industry 2025
Program Preview
We are pleased to announce first speakers of the upcoming event. A complete porgram will be published in January 2025
- TUTORIAL | Fundamentals of atomic layer deposition: a tutorial| Riikka Puurunen, Aalto University, Sweden
- TUTORIAL | Structure-Function Relationships in Precursor Design: Bridging Fundamental Insights with Practical Applications | Sean Barry, Carleton University, Canada
- Fabrication of Surface Relief Gratings using ALD-based Technologies to Overcome the Challenges of Reactive Ion Etching of TiO2 | Mathias Franz, Fraunhofer ENAS, Germany
- Direct Processing by µDALP™. Precision Coatings for Next Gen Devices | Maksym Plakhotnyuk, ATLANT 3D, Denmark
- Cryo- Atomic Layer Etching of Si, SiO2 and Si3N4 | Rémi Dussart, GREMI – Université d´Orléans, France
- High Speed Spatial PEALD Using a Novel Precursor Separation Method | Eric Dickey, Lotus Applied Technology, USA
- APECS Pilot Line – Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems | Wenke Weinreich, Fraunhofer IPMS, Germany
- Atomic Layer Etching – Applications & DFT Simulation | Joaquin Miranda, SAL – Silicon Austria Labs, Austria
- KEYNOTE | Past, present and future of ALD from an industrial perspective | Jan Willem Maes, ASM, Belgium
- Monitoring and optimisation of ALD processes with Remote Plasma Optical Emission Spectroscopy | Erik Cox, Gencoa Ltd, UK
- Optimizing Plasma-Assisted Atomic Layer Deposition using Impedans RFEAs | Angus McCarter, Impedans Ltd., UK
- Advanced in-situ QCM process monitoring | Martin Knaut, ALS Metrology UG, Germany
- ALD for Nanoparticles: From Fundamentals to Industrial Applications | Rong Chen, University of Science and Technology HUST, China
- ALD for Memory Applications: a matter of details | Laura Nyns, IMEC, Belgium
- Industrial batch ALD for optical applications | Shuo Li, Afly Solution Oy, Finland
- Recent developments and emerging applications in atmospheric-pressure ALD on high-porosity membranes | Fred Roozeboom, University of Twente, Netherlands
- Challenges and Solutions in ALD of Thermal Budget Sensitive Ferroelectric Materials | Bart Vermeulen, Ferroelectric Memory Co GmbH, Germany
- Introducing a Surface Acoustic Wave-Based Miniaturized Aerosol Source for Controlled Liquid Precursor Delivery in ALD Processes | Mehrzad Roudini, Leibniz IFW, Germany
- Spatial ALD of IrO2 and Pt films for green H2 production by PEM electrolysis | Paul Poodt, SparkNano B. V., The Netherlands
- Nanoscale solid-state lithium-ion electrolytes enabled by atomic layer deposition | Messaoud Bedjaoui, CEA Leti, France
Program Committee
- Sean Barry, Carleton University, Canada
- Gloria Gottardi, Fondazione Bruno Kessler, Italy
- Christoph Hossbach, Applied Materials / Picosun Europe, Germany
- Martin Knaut, TU Dresden, Germany
- Laura Nyns, IMEC, Belgium
- Fred Roozeboom, University Twente, Netherlands
- Jonas Sundqvist, Alixlabs, Sweden
POSTER Exhibition
The Poster Submission is open until January 31, 2025. Please send us an Abstract for your Poster Application. PO001 | Deposition of High Quality Aluminium Fluoride Layers through Optimization of a PEALD Process using Al(CH3)3 and SF6 | Fabian Steger, RhySearch, Buchs, Austria PO002 | Evaluating the Enhanced Fire Resistance of Polyamide Fabric through Dual-Layer Treatment with ALD-ZnO and DOPO-Based Silane | Sebastian Lehmann, Leibniz IFW, Germany
PO003 | Improving atomic layer deposition process of silicon oxide (SiO2) and aluminum oxide (Al2O3) | Long Lei, Fraunhofer IMPS, Germany PO004 | Thin Film Characterization with Laser Ultrasonics | Mike Hettich, Research Center for Non-Destructive Testing GmbH, Austria PO005 | Surface and Interface modifications for thermoelectric materials using Atomic Layer Deposition (ALD) | Amin Bahrami, Leibniz IFW, Germany
Accompanying Exhibition and Sponsoring
This Conference provides the opportunity to present your company or institute at the accompanying exhibition. You want to present your products and services at the exhibition? Please register as Sponsor with included Conference Ticket. The exhibition will be included in the conference hall directly at the event. For further details, please discover the Sponsoring Offer
Please register using the registration form Exhibition List:
- Beneq, Finland
- Sempa Systems GmbH, Germany
- Epivalence Limited, United Kingdom
- Trumpf Hüttinger GmbH & Co. KG, Germany
- Lotus Applied Technology, USA
- Leibniz IFW, Germany
- HIDEN Analytical Europe GmbH, Germany
- MKS Instruments Deutschland GmbH, Germany
- AlixLabs AB, Sweden
- Aether Semiconductor, India
- Pegasus Chemicals Limited
- Dock Chemicals GmbH, Germany
- Lotus Applied Technology, USA
We are pleased about the support of our MAIN SPONSOR 2025. Thank you!