Workshop „Photonic Integrated Circuits | Mapping Thin-Film Processes to Industrial Architectures“

Photonic Integrated Circuits (PICs) are a key enabling technology for modern photonic systems and are used in a wide range of applications, including optical communication, data centers, sensing, medical technology, quantum technologies, and autonomous driving/systems. A central factor for their performance and scalability is the precise design, fabrication, and integration of thin‑film processes into industrial PIC architectures.

The workshop provides an overview of current developments and challenges along the entire process chain – from thin‑film materials and deposition technologies to their scale‑up and industrialization on photonic platforms relevant for manufacturing environments. Key topics include process integration, scalability, robustness, and manufacturability of photonic integrated circuits, as well as cross‑cutting aspects related to their implementation in industrial contexts. Both technological fundamentals and selected practical perspectives on industrial realization will be addressed, with the aim of fostering exchange between research and industry and stimulating new solution approaches.

The event is aimed at experts from research, development, and industry who are working with photonic integrated circuits, thin‑film technologies, and photonic system integration, as well as those planning to engage in this field in the future.

Come along, inspire each other and shape the future of these exiting topics together!

Program Commitee:
Dr. Andreas Ehrhardt | Photonics BW e.V.
Dr. Matthias Hutter | Fraunhofer IZM
Dr. Silvia Schwyn Thoeny | Evatec AG
Dr. Christian Schindler | Bühler Alzenau GmbH

Host:
Fraunhofer Heinrich-Hertz-Institute, Berlin, Germany

Poster Exhibition
As part of the workshop, we are pleased to host a poster exhibition showcasing ongoing research, emerging technologies, and innovative concepts in the fields of Applications & System Level, Materials & Requirements, Thin-Film Processes / Manufacturing, Design & Integration or Supply Chain & Scaling.
Your contribution is welcome, and we look forward to receiving your abstract. Please include: Title of the poster, Author(s) and affiliation(s), Abstract (max. 250 words).
At least one author must be registered for the workshop and present. Posters must be brought by the presenter (no on‑site printing available).
Abstract Submission & Questions directly via e‑mail to haertel@efds.org.

Click here for the sponsorship registration form

Participant Costs
Early Bird Price (until March 31, 2026) EUR 730.00
Standard Price (from April 1, 2026) EUR 830.00
Reduced Price (Students) EUR 420.00

Hotel Recommendations